Georgios Panagopoulos
1 indexed paper
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126
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Architecture×1
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2026
Design-Oriented Modeling of TSV Substrate Noise Coupling to Ring VCOs
The paper introduces a design-oriented methodology and a closed-form macromodel to quantify how noise coupled through Through-Silicon Vias (TSVs) degrades the spectral purity of sensitive RF oscillators, showing that noise spurs increase with aggressor amplitude.
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