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20 results for “High-resolution 3D IC thermal simulation”

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cs.AREmpiricalRecentJun 16, 2026

CUTh-Solver: GPU-Accelerated Sparse Matrix Solver for High-Resolution Thermal Simulation of 3D ICs

Chenghan Wang, Zhen Zhuang, Shui Jiang, Siyuan Liang +8 more

This paper proposes CUTh-Solver, a GPU-accelerated Preconditioned Conjugate Gradient (PCG)-based sparse solver framework for high-resolution 3D IC thermal simulation, achieving significant speedup ove…

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cs.AREmpiricalRecentJul 7, 2026

GPU-Accelerated Effective Resistance Analysis for 3D IC Power Delivery Network

Jingchao Hu, Cheng Zhuo, Zhou Jin

This paper proposes a GPU-accelerated framework for analyzing effective resistance in 3D IC power delivery networks, achieving significant speedup with negligible error.

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cs.ARcs.AIRecentMay 30, 2026

LP5X-PIM Sim: A High-Fidelity HW/SW Integrated Simulator for LPDDR5X-PIM

SangHoon Cha, Jaewan Choi, Byeongho Kim, Yoonah Paik +2 more

This paper introduces a high-fidelity, integrated hardware-software simulator for LPDDR5X-PIM, enabling precise evaluation of system performance and energy efficiency.

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cs.ARRecentJun 4, 2026

Modeling, Optimizing and Exploring Multi-Die FPGA Routing Architectures

Amirhossein Poolad, Soheil Gholami Shahrouz, Andrew Boutros, Vaughn Betz

This paper enhances open-source FPGA CAD tools to model and explore inter-die routing architectures for 2.5D and 3D FPGAs, demonstrating that these architectures can significantly improve performance…

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cs.GRcs.CVcs.DCEmpiricalRecentJul 17, 2026

Rendering 3D Gaussians on a Graph Processor

Nicholas Fry, Ignacio Alzugaray, Mark Pupilli, Paul H. J. Kelly +1 more

First implementation of a 3D Gaussian renderer on an Intelligence Processing Unit (IPU) with 1,472 independent tiles using only on-chip SRAM.

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physics.acc-phcond-mat.mtrl-scicond-mat.supr-conRecentMay 29, 2026

Explicit Turn Resolution with Anisotropic Homogenisation for Efficient 3D Magneto-Thermal Finite-Element Simulation of Large-Scale No-Insulation HTS Magnets

Louis Denis, Erik Schnaubelt, Julien Dular, Mariusz Wozniak +2 more

The paper introduces the EXTRA homogenization method, which enables accurate and computationally efficient 3D magneto-thermal finite-element simulation of large-scale HTS magnets by selectively resolv…

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cs.ARcs.CRcs.LGEmpiricalRecentJul 4, 2026

SABLE: An NDA-Safe Closed-Loop LLM Framework for Analog Circuit Optimization in Industrial EDA Flows

Xunqi Li, Chris H. Kim

The paper presents SABLE, an NDA-safe framework that allows large language models to optimize analog circuits in industrial EDA tools while protecting proprietary information.

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cs.ARcs.ETRecentJun 4, 2026

Space-CIM: Enabling Compute-In-Memory Accelerators for Thermally-Constrained Space Platforms

Sohan Salahuddin Mugdho, Md. Shahedul Hasan, Cheng Wang

This paper investigates the thermal constraints of deploying AI compute infrastructure in space, comparing GPUs and compute-in-memory (CIM) accelerators using a co-design methodology.

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cs.AIRecentJun 1, 2026

Bridging the Sim-to-Real Gap in Semiconductor Visual Program Synthesis via Input Binarization

Yusuke Ohtsubo, Kota Dohi, Koichiro Yawata, Koki Takeshita +1 more

The paper proposes a visual program synthesis framework using a VLM to generate accurate training data for semiconductor inspection, mitigating the sim-to-real gap by applying input binarization to st…

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cs.ARcs.LGEmpiricalRecentJun 11, 2026

BigPower: Hierarchical Source-Level Module Power Estimation for CPUs with Large Language Models

Honghua Zhu, Chunjie Luo, Jianfeng Zhan

This paper introduces BigPower, a hierarchical source-level surrogate model for fine-grained module-level power estimation during CPU design using large language models and architectural hierarchy.

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cs.ARcs.AIcs.ETNEWEmpiricalJul 29, 2026

LLMET: Enabling Cross-Layer Evaluation of Emerging M3D Memories for Energy-Efficient LLM Serving

Ming-Yen Lee, Hanchen Yang, Faaiq Waqar, Harsono Simka +3 more

This paper investigates the energy efficiency of Large Language Model (LLM) serving using emerging memory technologies, specifically monolithic 3D (M3D) integration, and presents simulation results sh…

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cs.AREmpiricalRecentJun 15, 2026

PDAGENT-BENCH: Characterizing, Grounding, and Architecting LLM Agents for VLSI Physical Design

Qiufeng Li, Rongqian Chen, Quan Cheng, Chengxuan Wang +8 more

This paper introduces PDAGENT-BENCH, a comprehensive benchmark for evaluating Large Language Models and vision-language models in the physical design stack of Very Large-Scale Integrated Circuits.

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cs.ARcs.PFEmpiricalRecentJun 12, 2026

Extended Abstract: Re-Evaluating the Real-System Modeling Accuracy of Ramulator 2.0

F. Nisa Bostanci, Haocong Luo, Ataberk Olgun, Maria Makeenkova +3 more

The authors of Ramulator 2.0 simulator challenge the claims made in a research paper about its performance and propose best practices to avoid simulator usage errors.

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cs.ARcs.ETRecentMay 27, 2026

Nonvolatile Charge-Domain Attention with HZO Ferroelectric Capacitors: A Simulation-Based Device-to-System Evaluation

Faris Abouagour

The paper proposes a Ferroelectric Charge-Domain Compute Cell (FCDC) using HZO memcapacitors to perform attention computation, achieving significant energy efficiency gains, especially for long-reside…

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cs.LGcs.AIRecentMay 31, 2026

PALTO: Physics-Informed Active Learning for Tri-Gate FinFET Design Optimization for Vertical Power Delivery

Ayoub Sadeghi, Leonid Popryho, Inna Partin-Vaisband

The paper introduces a physics-informed active learning framework to optimize GaN tri-gate FinFETs for vertical power delivery, identifying a multi-fin device (D1) that significantly outperforms a sin…

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cs.LGcs.ETphysics.app-phTheoreticalRecentJul 17, 2026

A Blueprint for Equilibrium-Based Differentiable Continuous-Variable Thermodynamic Computing

Owen Lockwood, Jérémy Béjanin, Joost Bus, Christopher Chamberland +3 more

This paper proposes a thermodynamic computing stack for machine learning using stochastic analog processes and energy-based models.

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cs.ARRecentMay 28, 2026

Design-Oriented Modeling of TSV Substrate Noise Coupling to Ring VCOs

Ilias Exouzidis, Alberto Garcia-Ortiz, George Floros, Georgios Panagopoulos

The paper introduces a design-oriented methodology and a closed-form macromodel to quantify how noise coupled through Through-Silicon Vias (TSVs) degrades the spectral purity of sensitive RF oscillato…

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cs.PFcs.ARcs.DCRecentMay 28, 2026

From Roofline to Ruggedness: Decomposing and Smoothing the GEMM Performance Landscape

Aditya Chatterjee

The paper introduces performance ruggedness analysis to quantify performance variance in GEMM workloads, proposing a two-stage software stack that significantly smooths the performance landscape and b…

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